Apple-Meta Muse Spark Open: Local AI and the Chip Supply Chain
The Apple-Meta Muse Spark Open announcement shows a capable open-weight model running locally on two 512 GB Macs, and what it means for memory, packaging, and...
Read articleDS90CR288MTD - Texas Instruments Interface IC, TSSOP-56
Regular price
$7.81
After you place an order, our sales team will send written confirmation of the final price, shipping charges, and estimated delivery lead time. Import duties, taxes, brokerage fees, and other destination charges are the customer's responsibility. When needed, we can assist with available product information and customs documents for import declaration; final customs clearance and payment remain the customer's responsibility.
Couldn't load pickup availability
DS90CR288MTD
4 28 Driver 3V 3.6V LVDS -0.1V 100mV 2.1Gbps TSSOP-56 surface mount 14mm*6.1mm*900µm
Available Stock: 48TSSOP-56Obsolete
ManufacturerTexas Instruments
PackageTSSOP-56
Stock48
Standard Pack1
Pricing & Ordering
Unit Price$7.8118
Basic Information
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer Part Number | DS90CR288MTD |
| IC Category | Driver & Interface Integrated Circuits |
| Package | TSSOP-56 |
| Lifecycle Status | Obsolete |
Technical Attributes
| Applications | - |
|---|---|
| Interface | - |
| Voltage - Supply | 3V ~ 3.6V |
| Package / Case | 56-TFSOP (0.240", 6.10mm Width) |
| Supplier Device Package | 56-TSSOP |
| Mounting Type | Surface Mount |
Inventory and pricing are updated regularly. Technical data is provided for engineering reference.
Datasheet PDF
MANUFACTURER ACCESS
Manufacturers We Source
Browse frequently requested semiconductor and electronic component manufacturers, then search the catalog or submit an RFQ for the exact part you need.
From the desk
Recent Articles
Market signals, technical notes, and practical sourcing guidance for semiconductor procurement.
Vicor's 337 Investigation: Luxshare, Foxconn and the Battle Over Vertical Power Delivery
A patent dispute over vertical power delivery has pulled Luxshare, Foxconn Industrial Internet and Ingrasys into a USITC investigation. The technology is becoming central to AI...
Read article
Four Signals in the Chip Supply Chain: Demand Is Running Ahead of Capacity
AI demand, rising component prices, fully loaded fabs and long-term capacity lock-ups point to the same conclusion: supply is tight and demand is still accelerating.
Read article
AI Optical Modules Are Sold Out to 2029: The Real Bottleneck in the AI Build-Out
Lumentum says its optical capacity is booked into early 2029, while FCC restriction rumors raise long-term questions. Here is the full analysis of the optical module...
Read article
Electronic Component Date Codes: How Old Is Too Old?
Semiconductor Sourcing | Quality & Traceability A supplier offers you an IC with a 2021 date code. It is now 2026. Is the component too old...
Read article
NVIDIA Eyes Reflection AI: The 45x Valuation Jump and the Open-Weight Arms Race
A two-year-old startup founded by ex-DeepMind researchers has gone from USD 545M to USD 25B in valuation. NVIDIA wants in, and the prize is not just...
Read article
ASML Q3 2026: EUR 11.7B Revenue, 57.5% Margin and a Lithography Shortage That Runs to 2028
ASML's Q3 2026 results show an AI-driven lithography boom: record margins, 113 new systems shipped, and customers discussing 2029 and 2030 orders. Capacity remains the constraint.
Read article
Samsung Locks 80% of 2027 Memory Output for AI: The Breaking Story Behind the Memory Supercycle
Samsung has reportedly locked nearly 80% of its 2027 memory capacity into multi-year AI contracts with NVIDIA, Google and Microsoft. The full breaking analysis of HBM,...
Read article