KLMBG2JETD-B041 FBGA-153 package reference
KLMBG2JETD-B041 FBGA-153 package reference
SAMSUNG

KLMBG2JETD-B041 - SAMSUNG RF-integroidut piirit

In stock
SKU: KLMBG2JETD-B041-FBGA-153
(0)
$40.80
Kun olet tehnyt tilauksen, myyntitiimimme lähettää kirjallisen vahvistuksen lopullisesta hinnasta, toimituskuluista ja arvioidusta toimitusajasta. Tuontitullit, verot, välityspalkkiot ja muut kohdemaksut ovat asiakkaan vastuulla. Autamme tarvittaessa saatavilla olevien tuotetietojen ja tuonti-ilmoitusten tulliasiakirjojen kanssa; Lopputullaus ja maksu jäävät asiakkaan vastuulle.

KLMBG2JETD-B041

32GB 1.7V 3.6V FBGA-153 surface mount 13mm*11.5mm*800µm

Available Stock: 1120FBGA-153Active
ManufacturerSAMSUNG
PackageFBGA-153
Stock1120
Standard Pack-

Pricing & Ordering

Unit Price$40.8000

Basic Information

Manufacturer SAMSUNG
Manufacturer Part Number KLMBG2JETD-B041
IC Category RF Integrated Circuits
Package FBGA-153
Lifecycle Status Active

Technical Attributes

Supply Voltage 1.7V
Package BGA-153
Dimensions 13mm×11.5mm
Source Parameters 32GB 1.7V 3.6V FBGA-153 surface mount 13mm*11.5mm*800µm

Inventory and pricing are updated regularly. Technical data is provided for engineering reference.

Datasheet

Download PDF

MANUFACTURER ACCESS

Manufacturers We Source

Browse frequently requested semiconductor and electronic component manufacturers, then search the catalog or submit an RFQ for the exact part you need.

Manufacturer names and logos are used for product identification and navigation. Their display does not imply authorization, affiliation or endorsement. Availability is confirmed per quotation.

From the desk

Recent Articles

Market signals, technical notes, and practical sourcing guidance for semiconductor procurement.

View all articles