NT2L1001G0DUDV FFC-BUMP-DIE-ON-FILM-FRAME-CARRIER package
NT2L1001G0DUDV FFC-BUMP-DIE-ON-FILM-FRAME-CARRIER package
NXP Semiconductors

NT2L1001G0DUDV - NXP Semiconductors RF-samrásir

In stock
SKU: NT2L1001G0DUDV
(0)
$0.07
Eftir að þú hefur lagt inn pöntun mun söluteymi okkar senda skriflega staðfestingu á endanlegu verði, sendingarkostnaði og áætlaðan afhendingartíma. Aðflutningsgjöld, skattar, miðlunargjöld og önnur áfangastaðagjöld eru á ábyrgð viðskiptavinarins. Þegar þörf krefur getum við aðstoðað með tiltækar vöruupplýsingar og tollskjöl fyrir innflutningsskýrslu; endanleg tollafgreiðsla og greiðsla er áfram á ábyrgð viðskiptavinarins.

NT2L1001G0DUDV

IC RF Integrated Circuits IC Package

Available Stock: 11237300IC PackageActive
ManufacturerNXP Semiconductors
PackageIC Package
Stock11237300
Standard Pack112373

Pricing & Ordering

Unit Price$0.0707

Basic Information

Manufacturer NXP Semiconductors
Manufacturer Part Number NT2L1001G0DUDV
IC Category RF Integrated Circuits
Package FFC-BUMP-DIE-ON-FILM-FRAME-CARRIER
Lifecycle Status Active

Technical Attributes

Technical data Available in the linked datasheet.

Inventory and pricing are updated regularly. Technical data is provided for engineering reference.

MANUFACTURER ACCESS

Manufacturers We Source

Browse frequently requested semiconductor and electronic component manufacturers, then search the catalog or submit an RFQ for the exact part you need.

Manufacturer names and logos are used for product identification and navigation. Their display does not imply authorization, affiliation or endorsement. Availability is confirmed per quotation.

From the desk

Recent Articles

Market signals, technical notes, and practical sourcing guidance for semiconductor procurement.

View all articles