TLV3601DCKT - Texas Instruments RF-geïntegreerde schakelingen
Regular price
$3.98
Nadat u een bestelling heeft geplaatst, stuurt ons verkoopteam een schriftelijke bevestiging van de uiteindelijke prijs, verzendkosten en geschatte levertijd. Invoerrechten, belastingen, makelaarskosten en andere bestemmingskosten zijn de verantwoordelijkheid van de klant. Indien nodig kunnen wij u helpen met beschikbare productinformatie en douanedocumenten voor aangifte ten invoer; de uiteindelijke inklaring en betaling blijven de verantwoordelijkheid van de klant.
Couldn't load pickup availability
TLV3601DCKT
CMOS, Push-Pull, Rail to Rail 1 2.4V 5.5V 5mV@ 5V 1µA@ 5V SC-70-5 surface mount, adhesive mount
Available Stock: 328SC-70-5Active
ManufacturerTexas Instruments
PackageSC-70-5
Stock328
Standard Pack1
Pricing & Ordering
Unit Price$3.9758
Basic Information
| Manufacturer | Texas Instruments |
|---|---|
| Manufacturer Part Number | TLV3601DCKT |
| IC Category | RF Integrated Circuits |
| Package | SC-70-5 |
| Lifecycle Status | Active |
Technical Attributes
| Type | Standard (General Purpose) |
|---|---|
| Number of Elements | 1 |
| Output Type | CMOS, Push-Pull, Rail-to-Rail |
| Voltage - Supply, Single/Dual (±) | 2.4V ~ 5.5V |
| Voltage - Input Offset (Max) | 5mV @ 5V |
| Current - Input Bias (Max) | 1µA @ 5V |
| Current - Output (Typ) | 30mA @ 5V |
| Current - Quiescent (Max) | 7mA |
| CMRR, PSRR (Typ) | 80dB CMRR, 80dB PSRR |
| Propagation Delay (Max) | 3.5ns |
| Hysteresis | 5mV |
| Operating Temperature | -40 degC ~ 125 degC |
| Package / Case | 5-TSSOP, SC-70-5, SOT-353 |
| Mounting Type | Surface Mount |
| Supplier Device Package | SC-70-5 |
Documents & Engineering Resources
Inventory and pricing are updated regularly. Technical data is provided for engineering reference.
Datasheet PDF
MANUFACTURER ACCESS
Manufacturers We Source
Browse frequently requested semiconductor and electronic component manufacturers, then search the catalog or submit an RFQ for the exact part you need.
Blogberichten
-
Chip Seek Editorial TeamSamsung Locks 80% of 2027 Memory Output for AI: The Breaking Story Behind the Memory Supercycle
-
Chip Seek Editorial TeamIntel Kiryat Gat Fab Explosion: Supply-Chain Impact for Chip Buyers
