MC7457VG1000NC - NXP Semiconductors एकीकृत परिपथ और चिप्स
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MC7457VG1000NC
1GHz 1 1.71V, 1.425V, 1.25V 1.35V, 1.575V, 2.625V 1.5V, 1.8V, 2.5V PowerPC G4 483-BCBGA / FCCBGA surface mount, 29 × 29 mm body, 483 balls, 1.27 mm pitch
Basic Information
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer Part Number | MC7457VG1000NC |
| IC Category | Application Processors & SoC |
| Package | 483-BCBGA / FCCBGA (29 × 29 mm) |
| Lifecycle Status | Obsolete |
Product Description
1GHz 1 1.71V, 1.425V, 1.25V 1.35V, 1.575V, 2.625V 1.5V, 1.8V, 2.5V PowerPC G4 483-BCBGA / FCCBGA surface mount, 29 × 29 mm body, 483 balls, 1.27 mm pitch
Technical Attributes
| Supply Voltage | 1.71V |
|---|---|
| Dimensions | 29mm × 29mm |
Documents
Inventory and pricing are updated regularly. Technical data is provided for engineering reference.
Package Information
Package: 483-BCBGA / FCCBGA, with a 29 × 29 mm body, 483 solder balls (22 × 22 array minus one ball), and 1.27 mm ball pitch. Mounting: surface mount (SMT). The manufacturer datasheet describes this footprint as 483 CBGA / RoHS BGA; the VG ordering code identifies the RoHS BGA option.
Source: MPC7457 Hardware Specifications, Rev. 8, Section 8.4, page 47; Table 22, page 66.
Datasheet PDF
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