MC9328MXLVP15 - NXP Semiconductors Circuitos integrados e chips
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MC9328MXLVP15
150MHz SRAM 1 150MHz 1.8V, 3V I2C, I2S, MMC, SD, SPI, SSI, UART ARM920T MAPBGA-225 surface mount 13 × 13 mm (body), 1.25–1.60 mm height
Basic Information
| Manufacturer | NXP Semiconductors |
|---|---|
| Manufacturer Part Number | MC9328MXLVP15 |
| IC Category | Application Processors & SoC |
| Package | 225-MAPBGA / 225-LFBGA (13 × 13 mm) |
| Lifecycle Status | Active |
Product Description
150MHz SRAM 1 150MHz 1.8V, 3V I2C, I2S, MMC, SD, SPI, SSI, UART ARM920T MAPBGA-225 surface mount 13 × 13 mm (body), 1.25–1.60 mm height
Technical Attributes
| Supply Voltage | 1.8V |
|---|---|
| Frequency | 150MHz |
| Package | 225-MAPBGA / 225-LFBGA (13 × 13 mm) |
| Peripherals | I2C, SPI, UART, I2S, MMC, SSI |
| Dimensions | 13mm × 13mm |
Documents
Inventory and pricing are updated regularly. Technical data is provided for engineering reference.
Package Information
MC9328MXLVP15 uses a 225-MAPBGA package (also described as 225-LFBGA), with a 13 × 13 mm body, 225 solder balls in a 15 × 15 array, and 0.8 mm ball pitch. Package height is 1.25–1.60 mm. NXP case outline: 1304B-01. Mounting: surface mount (SMT).
Source: NXP MC9328MXL Technical Data, Rev. 8, Section 5.2, Figure 68, page 87.
Datasheet PDF
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